A method of forming a solder joint, comprising: (a) providing a lead-free, tin-containing solder alloy; (b) providing a printed wiring board substrate or a ball grid array substrate, said substrate being formed from a material comprising copper, optionally also zinc, and one or more of Ni, Co, Cr, Mn, Zr, Fe and Si and/or alloys thereof; (c) heating the solder alloy; and (d) either before, during or after step (c) contacting the solder alloy with the substrate.
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