首页> 外国专利> LASER PEENING METHOD AND APPARATUS USING ABLATION LAYERS TO PREVENT PITTING DURING LASER PEENING

LASER PEENING METHOD AND APPARATUS USING ABLATION LAYERS TO PREVENT PITTING DURING LASER PEENING

机译:使用烧蚀层防止激光点蚀期间的点蚀的激光点蚀方法和装置

摘要

A hybrid ablation layer that comprises a separate under layer is applied to a material to prevent pitting resulting from laser peening. The underlayer adheres to the surface of the workpiece to be peened and does not have bubbles and voids that exceed an acceptable size. One or more overlayers are placed over and in contact with the underlayer. Any bubbles formed under the over layers are insulated from the surface to be peened. The process significantly reduces the incidence of pits on peened surfaces.
机译:将包括单独的底层的混合烧蚀层施加到材料上,以防止激光喷丸造成的点蚀。底层粘附到待喷丸的工件表面,并且没有气泡和空隙超过可接受的尺寸。将一个或多个叠加器放置在底层之上并与之接触。覆盖层下面形成的任何气泡均与待喷丸的表面绝缘。该工艺可大大减少喷丸表面上的凹坑。

著录项

  • 公开/公告号EP1960154A2

    专利类型

  • 公开/公告日2008-08-27

    原文格式PDF

  • 申请/专利权人 LAWRENCE LIVERMORE NATIONAL SECURITY LLC;

    申请/专利号EP20060849830

  • 发明设计人 HACKEL LLOYD A.;

    申请日2006-09-28

  • 分类号B23K26;B23K26/18;C21D10;

  • 国家 EP

  • 入库时间 2022-08-21 19:55:23

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