首页> 外国专利> A COMPOSITION OF ETCHING SOLUTION FOR METAL FILM USING IN MANUFACTURING PROCESS OF THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAY AND ETCHING METHOD USING THE SAME

A COMPOSITION OF ETCHING SOLUTION FOR METAL FILM USING IN MANUFACTURING PROCESS OF THIN FILM TRANSISTOR LIQUID CRYSTAL DISPLAY AND ETCHING METHOD USING THE SAME

机译:用于制造薄膜晶体管液晶显示过程的金属膜蚀刻溶液的组成及使用该方法的蚀刻方法

摘要

An etchant composition for a metal film used in the manufacturing process of a TFT-LCD device, and a method for etching a metal film by using the etchant composition are provided to control the etching velocity freely, to obtain a satisfactory taper profile angle of 30-60 degrees and to improve the alignment of pattern. An etchant composition comprises 1-40 wt% of a compound containing Fe^3+; 0.1-10.0 wt% of a fluorine compound; and 50-98.1 wt% of water, and contains no an acidic compound. Preferably the compound containing Fe^3+ is selected from the group consisting of FeCl3, Fe(NO3)3, Fe2(SO4)3, NH4Fe(SO4)2, Fe(ClO4)3, FePO4 and Fe(NH4)3(C2O4)3; and the fluorine compound is selected from the group consisting of NaF, NaHF2, NH4F, NH4HF2, NH4BF4, NH4F, HF, KF, KHF2, AlF3 and HBF4.
机译:提供用于TFT-LCD装置的制造过程中的用于金属膜的蚀刻剂组合物,以及通过使用该蚀刻剂组合物蚀刻金属膜的方法,以自由地控制蚀刻速度,以获得令人满意的30°的锥角。 -60度并改善图案的对齐方式。蚀刻剂组合物包含1-40wt%的含有Fe 3+的化合物;和0.1-10.0重量%的氟化合物;和50-98.1重量%的水,并且不包含酸性化合物。优选地,包含Fe 3+的化合物选自FeCl 3,Fe(NO 3)3,Fe 2(SO 4)3,NH 4 Fe(SO 4)2,Fe(ClO 4)3,FePO 4和Fe(NH 4)3(C 2 O 4)。 )3;氟化合物选自NaF,NaHF 2,NH 4 F,NH 4 HF 2,NH 4 BF 4,NH 4 F,HF,KF,KHF 2,AlF 3和HBF 4。

著录项

  • 公开/公告号KR20080016290A

    专利类型

  • 公开/公告日2008-02-21

    原文格式PDF

  • 申请/专利权人 DONGWOO FINE-CHEM CO. LTD.;

    申请/专利号KR20060078215

  • 发明设计人 KIM SOON SHIN;CHOI YONG SUK;LEE SUK;

    申请日2006-08-18

  • 分类号C09K13/04;C09K13/06;C09K13/08;

  • 国家 KR

  • 入库时间 2022-08-21 19:54:09

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