COMPOSITION OF ETCHING SOLUTIONS FOR MULTILAYERS OF CU AND MOLYBDENUM

摘要

An etchant composition for a multilayer comprising copper and molybdenum is provided to remove the problem of instability and to prevent the generation of etching residue and the decrease of brightness. An etchant composition for a multilayer comprising copper and molybdenum comprises 1-30 wt% of CuCl2; 0.5-5 wt% of an organic acid; 0.2-5 wt% of a phosphate sa 0.2-5 wt% of a first nitrogen-containing additive; 0.2-5 wt% of a second nitrogen-containing additive; 0.01-1.0 wt% of a fluorine compound; and the balance of deionized water. Preferably the organic acid is selected from acetic acid, butanoic acid, citric acid, formic acid, gluconic acid, glycolic acid, malonic acid, oxalic acid, pentanoic acid and other water-soluble organic acids.