POSITIVE PHOTOSENSITIVE COMPOSITION, POLYMER COMPOUNDS FOR USE IN THE POSITIVE PHOTOSENSITIVE COMPOSITION, MANUFACTURING METHOD OF THE POLYMER COMPOUNDS, COMPOUNDS FOR USE IN THE MANUFACTURE OF THE POLYMER COMPOUNDS, AND PATTERN-FORMING METHOD USING THE POSITIVE PHOTOSENSITIVE COMPOSITION

摘要

A positive photosensitive composition is provided to form a resist pattern having higher sensitivity and more improved pattern collapse characteristics. A positive photosensitive composition includes a polymer compound having an acid-labile structure at the terminal of the polymer compound, and a compound capable of generating an acid upon irradiation with actinic rays or radiation. The polymer compound has a structure represented by the following formula 1 at the terminal, wherein R1 represents an alkyl group, cycloalkyl group, or aryl group, R2 represents an alkylene group, cycloalkylene group, or arylene group, R3 and R4 independently represent a hydrogen atom, alkyl group, cycloalkyl group, alkenyl group, or aryl group, or are bonded to the neighboring R1 to form a cyclic structure if at least one of R3 and R4 does not represent a hydrogen atom, and n represents 0 or 1.