POSITIVE RESIST COMPOSITION FOR FORMING THICK RESIST FILM, OBJECT COATED WITH THICK RESIST, AND METHOD OF FORMING RESIST PATTERN

摘要

A positive resist composition which is for forming a thick resist film having a thickness of 1-15 mum. The positive resist composition comprises: a resin ingredient (A) comprising a polymer (A1) having a mass-average molecular weight of 20,000-50,000 and having a structural unit (a1) derived from hydroxystyrene and a structural unit (a2) containing an acid-dissociable dissolution-inhibitive group and derived from an acrylic ester; an acid generator ingredient (B) which comprises an onium salt type acid generator having an anionic part represented by the general formula (I): R4''SO3- (wherein R4'' represents linear or branched, C4 alkyl or fluoroalkyl) and which generates an acid upon exposure to light; and a nitrogenous organic compound (D) comprising a tertiary aliphatic amine.