首页> 外国专利> A PHASE-CHANGE MEMORY UNIT, METHOD OF MANUFACTURING THE PHASE-CHANGE MEMORY UNIT, A PHASE-CHANGE MEMORY DEVICE HAVING THE PHASE-CHANGE MEMORY UNIT AND METHOD OF MANUFACTURING THE PHASE-CHANGE MEMORY DEVICE

A PHASE-CHANGE MEMORY UNIT, METHOD OF MANUFACTURING THE PHASE-CHANGE MEMORY UNIT, A PHASE-CHANGE MEMORY DEVICE HAVING THE PHASE-CHANGE MEMORY UNIT AND METHOD OF MANUFACTURING THE PHASE-CHANGE MEMORY DEVICE

机译:相变存储器单元,制造相变存储器单元的方法,具有相变存储器单元的相变存储器装置和制造相变存储器装置的方法

摘要

A phase-change memory unit, a method for manufacturing the same, a phase-change memory device having the same, and a method for manufacturing the same phase-change memory device are provided to form a phase-change material layer on a core forming layer by performing a chemical vapor deposition process. A first electrode(125) is formed on a substrate(100). An insulating structure includes an opening for exposing the first electrode. A core forming layer(140) is formed on the first electrode and a sidewall of the opening. A phase-change material layer(145) is formed on the core forming layer in order to fill up the opening. A second electrode(150) is formed on the phase-change material layer. A lower structure(105) is formed on the substrate. A lower insulating structure(110) is formed to cover the lower structure. A pad(120) is formed in the lower insulating structure in order to connect electrically the first electrode with the lower structure.
机译:提供一种相变存储单元,其制造方法,具有该相变存储器件的方法以及用于制造该相变存储器件的方法,以在芯形成体上形成相变材料层。通过执行化学气相沉积工艺形成层。在基板(100)上形成第一电极(125)。绝缘结构包括用于暴露第一电极的开口。在第一电极和开口的侧壁上形成芯形成层(140)。为了填充开口,在芯形成层上形成相变材料层(145)。在相变材料层上形成第二电极(150)。在基板上形成下部结构(105)。形成下部绝缘结构(110)以覆盖下部结构。在下部绝缘结构中形成焊盘(120),以将第一电极与下部结构电连接。

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