PURPOSE: A system for applying a photoresist layer in a photolithography process is provided to improve the uniformity of application of a photoresist layer to the front surface of a wafer and prevent a defect caused by ununiformity of the application by simultaneously injecting photoresist liquid to the center and the periphery of the wafer and by tilting a rotation axis of a chuck to a vertical line and tilt-rotating the rotation axis. CONSTITUTION: A photoresist liquid supplying table(201) horizontally reciprocates in a spacer corresponding to the area of the wafer(203) in a position vertically separated from the wafer by a predetermined distance. A flow path of the photoresist liquid is installed in the inner space of the photoresist liquid supplying table. At least one photoresist liquid injecting apparatus is installed under the photoresist liquid supplying table, separated from the photoresist liquid supplying table by a predetermined distance, including a photoresist liquid injecting nozzle(202) for injecting the photoresist liquid to the surface of the wafer. A wafer mounting chuck(204) rotates with respect to an axis, capable of tilting the axis in a vertical position by a predetermined angle so as to rotate horizontally and slantingly.
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