WAFER-LEVEL ACF FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACF/NCF

摘要

A method for fabricating a wafer-level flip chip package is provided to suppress shadow effects by using ACA(Anisotropic Conductive Adhesives) for easily adjusting coating thickness and NCA(Non-Conductive Adhesives), for achieving high selectivity in electrical connections while stabilizing a bonding process. A method for fabricating a wafer-level flip chip package comprises the steps of: forming a non-conductive layer(115) by coating and drying non-conductive mixture solution containing insulating polymer resin, hardener, and organic solvent onto a wafer(100) on which a non-solder bump(113) is formed; forming an anisotropic conductive layer(116) by coating and drying conductive mixture solution containing insulating polymer resin, hardener, organic solvent, and conductive materials onto the non-conductive layer; dicing the wafer coated with the non-conductive layer and anisotropic conductive layer to form individual semiconductor chips(200); and subjecting the individual semiconductor chip to a flip-chip bonding in alignment with an electrode of a substrate.