首页> 外国专利> Power - semiconductor element with diodes devices for temperature and for absorbing of static electricity, as well as power - a semiconductor device with such a power - semiconductor element

Power - semiconductor element with diodes devices for temperature and for absorbing of static electricity, as well as power - a semiconductor device with such a power - semiconductor element

机译:功率-具有用于温度和吸收静电的二极管器件的半导体元件以及功率-具有这种功率的半导体器件-半导体元件

摘要

Power - semiconductor element (1), comprising:– a semiconductor substrate (1s);– a power - half conductor element component (1a), on the semiconductor substrate (1s) is formed;– a on the semiconductor substrate (1s) formed on the other side of the first diode device (1b) for detecting a temperature of the power - half conductor element component (1a) and– a on the semiconductor substrate (1s) and formed between two terminals of the first diode device (1b) switched second diode device (1c) for absorbing of static electricity,the first diode device (1b) a plurality of first diodes (1bd), are connected one after the other in the conducting direction,the second diode device (1c) parallel to the first diode device (1b) is switched to the non-conducting direction,the second diode device (1c) a plurality of second diodes (1cd), are connected one after the other in the reverse direction,the number of the second diodes (1cd) with the number of the first diodes (1bd) is identicaland wherein the high frequency - impedance characteristic of the second diode device (1c) in a frequency band of an electromagnetic interference shaft, the..
机译:功率-半导体元件(1),包括:-半导体衬底(1s);-功率-在半导体衬底(1s)上形成半导体元件组件(1a);-形成在半导体衬底(1s)上的a在第一二极管器件(b)的另一侧上,用于检测功率的温度-半导体衬底(1s)上的半导体元件(1a)和-a形成在第一二极管器件(b)的两个端子之间开关式第二二极管装置(1c)用于吸收静电,第一二极管装置(1b)和多个第一二极管(1bd)在导电方向上一个接一个地连接,第二二极管装置(1c)与第一二极管装置(1b)被切换到非导通方向,第二二极管装置(1c)的多个第二二极管(1cd)沿反方向依次连接,第二二极管(1cd)的数量),其中第一二极管(1bd)的数量相同,并且其中高频-第二个二极管装置(1c)在电磁干扰轴的频带中的阻抗特性。

著录项

  • 公开/公告号DE10103337B4

    专利类型

  • 公开/公告日2008-07-31

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE2001103337

  • 发明设计人

    申请日2001-01-25

  • 分类号H01L23/64;H01L29/70;

  • 国家 DE

  • 入库时间 2022-08-21 19:50:13

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