A process for the creation of a heat - and shock-proof connection of the modules - semiconductor, and to the pressure sintering prepared semiconductor device

摘要

An electronic assembly with a fixed electrically and thermally highly conductive sintered connection of a semiconductor - module on a connected elements from the group consisting of substrate, further semiconductors or circuit carrier, wherein the sintered connection is a power sintering connection, which consists of a dried, at least on the wafer backside before the separation of the semiconductors - building blocks metal powder suspension applied in a preamplifier has tightly ends start - sintering step for a sawing mechanically during the separation was immobilized before, by means of final sintering, of the dried suspension layer occurring during sawing in the dimensions of the respective semiconductor - component of the fixed contact of the semiconductor has been produced with the connection partners. Also, a method for the production of a power sintering connection, indicated with a semiconductor.