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Semiconductor device, has trench with side wall-isolation extending from main surface deeply into semiconductor substrate and comprising conductive material extending from main surface to substrate layer

机译:半导体器件具有沟槽,该沟槽的侧壁隔离从主表面深深地延伸到半导体衬底中,并且包括从主表面延伸到衬底层的导电材料

摘要

The device has a control gate (13) arranged on a main surface (1) over an insulating layer. A drain region (15) is provided in the main surface. A source region (6) is formed in a trough region (4), which is formed in the main surface of a semiconductor substrate (2). A metallization layer (19) is arranged on the main surface. A trench (9) with side wall-isolation (10) extends from the main surface deeply into the semiconductor substrate. The trench has conductive material (8) extending from the main surface to a substrate layer (11).
机译:该装置具有布置在绝缘层上方的主表面(1)上的控制栅(13)。在主表面上设置有漏区(15)。在形成于半导体衬底(2)的主表面上的槽区域(4)中形成源极区域(6)。在主表面上布置有金属化层(19)。具有侧壁隔离物(10)的沟槽(9)从主表面深深地延伸到半导体衬底中。沟槽具有从主表面延伸到衬底层(11)的导电材料(8)。

著录项

  • 公开/公告号DE102006038874A1

    专利类型

  • 公开/公告日2008-03-20

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AUSTRIA AG;

    申请/专利号DE20061038874

  • 发明设计人 ROTHLEITNER HUBERT;

    申请日2006-08-18

  • 分类号H01L29/78;H01L21/762;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:48

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