Construction unit has two chips that are arranged one above other in connecting area by blocking or tilting microstructures in each other turned chip surfaces, which are mechanically and electrically connected

摘要

The construction unit (10) has two chips (11,12) that are arranged one above the other in connecting area by blocking or tilting microstructures (16) in each other turned chip surfaces, which are mechanically and electrically connected with one another. The microstructures are formed in a doped semiconductor material. The structural elements of the two interlocking microstructures are arranged in a pattern. An independent claim is also included for a method for the assembling a construction unit.