Method for producing soldered joint between two elements, involves transferring heat in two elements that are to be connected, and thin protective layer is applied between soldering stamp and two elements

摘要

The method involves transferring heat in two elements that are to be connected. A soldering temperature-resistant thin protective layer (20) is applied between the soldering stamp (16,17) and two elements. The protection layer is clamped during the soldering between the soldering stamp and the two elements. An independent claim is also included for a device to produce a soldered joint.