Circuit arrangement for measuring device, has electric contact fabricating conductive connection between substrate and microelectronic component, where part of electric contact is provided between substrate and microelectronic component

摘要

The circuit arrangement has a substrate (1), a microelectronic component (2) and an electric contact. The electric contact (3,3') fabricates a conductive connection between the substrate and the microelectronic component. A part of the electric contact is provided between the substrate and the microelectronic component. The microelectronic component is arranged at a distance for mechanically decoupling the microelectronic component and the substrate. An independent claim is also included for a method for the production of a circuit arrangement.