Improved microelectronic component electrical contact pad connection having microelectronic component directly attached printed circuit face with thin isolated attachment and through

摘要

The contact pad connection process connects the contact pad (7) of a microelectronic component (5) directly to printed circuits (11). The microelectronic component is directly attached to the principal face carrying the metallic pads using a thin isolated attachment layer (1). Holes are reamed out (8) facing the pads and metallised (12). Connection is then made directly to the printed circuit tracks (11) through the hole.