Method for the electrical contacting of microelectronic components on a printed circuit board

摘要

Method for electrically contacting one or more microelectronic components (2), which are applied with a rear side to a surface of a printed circuit board layer (1) or embedded in the surface of the printed circuit board layer (1) and have electrical contact surfaces (12) on a front side opposite the rear side which are accessible on the surface of the circuit board layer (1), in which - a metal foil (5) is connected to the surface of the circuit board layer (1) by means of an insulating binder (4) and - an electrical contact between the metal foil (5) and the electrical contact surfaces (12) is produced, - wherein on the contact surfaces (12) of the one or more microelectronic components (2) electrically conductive Kontaktierungshöcker (3, 10) are applied, one in connecting the metal foil (5) with the surface the circuit board layer (1) by the binder (4) layer formed completely constantly penetrate and prepared by the action of pressure and / or temperature during bonding the electrical contact between the metal foil (5) and the electrical contact surfaces (12).