Evaluation of a New Technique for the Deposition of Conductive Patterns and Contacts for Microelectronics

摘要

A new metallization technique was evaluated for the deposition of highly adherent conductive patterns and contacts for micro electronic applications. The technique involves a Field Emission Deposition (FED) Sprayer which is a metal droplet gun similar to ion guns. The metal droplets, approximately one micrometer in diameter, are electrically charged and can be manipulated using charge deflection methods. Thus, electrical interconnects and complex patterns of varying thickness can be drawn by the Sprayer on any surface. Gold droplets were deposited on substrates of stainless steel, glass, alumina and silicon. Rastering was employed in depositing thin lines and extended area patterns. Good adherent coatings were demonstrated on stainless and alumina substrates. Gold deposits on silicon (photovoltaic cell) were less adherent. Preliminary data from Phase 1 investigations indicate that fine lines (0.1mm or less) can be achieved using the FED process with the long term goal being in micron size dimensions.