首页> 外国专利> FET for use in e.g. microelectronic device, has heavily doped source/drain region of substrate arranged beneath pillar and remote from insulated gate

FET for use in e.g. microelectronic device, has heavily doped source/drain region of substrate arranged beneath pillar and remote from insulated gate

机译:FET用于微电子器件,具有重掺杂的衬底的源极/漏极区域,该区域布置在支柱下方且远离绝缘栅

摘要

A pillar (170) extends away from a substrate (100). The pillar includes a base adjacent to the substrate, top remote from the substrate and a sidewall that extends between the base and the top. A lightly doped source/drain region (N-) (320) of the substrate is arranged beneath the pillar and adjacent the insulated gate on the sidewall. A heavily doped source/drain region (N+) (310) of the substrate is arranged beneath the pillar and remote from the insulated gate. An independent claim is included for method of fabricating FET.
机译:柱(170)从衬底(100)延伸开。支柱包括邻近基板的底部,远离基板的顶部和在底部和顶部之间延伸的侧壁。衬底的轻掺杂源极/漏极区(N-)(320)被布置在支柱下方并且在侧壁上与绝缘栅相邻。衬底的重掺杂源/漏区(N +)(310)被布置在柱下方并且远离绝缘栅。对于制造FET的方法包括独立权利要求。

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