首页> 外国专利> GROOVING METHOD, CONTROL PROGRAM, COMPUTATION PROGRAM, CONTROL SYSTEM, AND PLASMA PROCESSING APPARATUS

GROOVING METHOD, CONTROL PROGRAM, COMPUTATION PROGRAM, CONTROL SYSTEM, AND PLASMA PROCESSING APPARATUS

机译:切槽方法,控制程序,计算程序,控制系统和等离子体处理装置

摘要

PROBLEM TO BE SOLVED: To provide a grooving method, a control program, a computation program, a control system and a plasma processing apparatus which can easily form a grooved part having a stable shape and surface without needing the work of apposing remaining materials on a part to be a product, in the case of forming the grooved part by plasma arc.;SOLUTION: The invented plasma processing apparatus 1 is equipped with a torch 2, a processing position holding mechanism 10, a tilting mechanism and a torch moving mechanism, and is controlled by the control system 20. In the case of forming the grooved part, the second or subsequent plasma process is performed so that the processed acral part of the working space by the preceding plasma process is formed within the area of the working space by the present plasma process, and the working space by the last plasma process reaches the other surface of a workpiece.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种开槽方法,控制程序,计算程序,控制系统和等离子处理设备,其可以容易地形成具有稳定的形状和表面的带凹槽的部件,而无需将剩余材料布置在基板上的工作。解决方案:本发明的等离子体处理设备1配备有割炬2,处理位置保持机构10,倾斜机构和割炬移动机构,并且由控制系统20控制。在形成带凹槽的部分的情况下,执行第二次或随后的等离子处理,从而在工作空间的区域内形成通过先前的等离子处理而处理的工作空间的尖端部分。通过当前的等离子工艺,最后一次等离子工艺的工作空间到达工件的另一个表面。;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2009241147A

    专利类型

  • 公开/公告日2009-10-22

    原文格式PDF

  • 申请/专利权人 NISSAN TANAKA CORP;

    申请/专利号JP20080093483

  • 发明设计人 IHARA DAISUKE;WASADA ATSUSHI;

    申请日2008-03-31

  • 分类号B23K31/00;B23K10/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:46:03

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