首页> 外国专利> HYDROPHOBIC TREATMENT METHOD, HYDROPHOBIC TREATMENT DEVICE, COATING, DEVELOPMENT APPARATUS, AND STORAGE MEDIUM

HYDROPHOBIC TREATMENT METHOD, HYDROPHOBIC TREATMENT DEVICE, COATING, DEVELOPMENT APPARATUS, AND STORAGE MEDIUM

机译:疏水处理方法,疏水处理设备,涂层,开发设备和存储介质

摘要

PROBLEM TO BE SOLVED: To provide a heat treatment apparatus speedily increasing and decreasing the temperature of a hot plate when heat-treating a substrate placed on the hot plate.;SOLUTION: The heat treatment apparatus includes: the hot plate for placing a substrate for heating; a hot plate temperature-controlling section for controlling the temperature of the hot plate according to the temperature of a temperature-controlled medium; and a control section. The control section controls the operations of a medium temperature-controlling means and a supply means to supply the temperature-controlled medium controlled to a temperature higher than a first temperature to the channel of the hot plate temperature-controlled section for changing the temperature of the hot plate to the first temperature higher than an arbitrary temperature from the arbitrary temperature, and to supply the temperature-controlled medium controlled to a temperature lower than a second temperature to the channel of the hot plate temperature-controlling section for changing the temperature of the hot plate to the second temperature lower than an arbitrary temperature from the arbitrary temperature, thus speedily increasing and decreasing the temperature of the hot plate.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种热处理装置,该热处理装置在对放置在加热板上的基板进行热处理时迅速地升高和降低加热板的温度。解决方案:热处理装置包括:用于放置基板的热处理板。加热;热板温度控制部分,用于根据温度控制介质的温度来控制热板的温度;和控制部分。控制部分控制介质温度控制装置和供应装置的操作,以将被控制到高于第一温度的温度的温度控制介质供应到热板温度控制部分的通道,以改变加热温度。将热板加热至高于任意温度的第一温度,并将被控制为低于第二温度的温度控制介质供应至热板温度控制部的通道,以改变加热温度。热板从低于任意温度的第二个温度降低到任意温度,从而迅速地升高和降低热板的温度。;版权所有:(C)2009,日本特许厅

著录项

  • 公开/公告号JP2009194239A

    专利类型

  • 公开/公告日2009-08-27

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20080035098

  • 发明设计人 FUKUOKA TETSUO;KITANO TAKAHIRO;

    申请日2008-02-15

  • 分类号H01L21/027;B05C9/10;B05B15/00;B05D3/04;

  • 国家 JP

  • 入库时间 2022-08-21 19:45:31

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