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Hydrophobic treatment method, the hydrophobic treatment equipment, coating, developing device and storage medium

机译:疏水处理方法,疏水处理设备,涂料,显影装置和存储介质

摘要

There are provided an adhesion promoting process using a comparatively small amount of an adhesion promoting gas for processing a workpiece, an adhesion promoting device for carrying out the adhesion promoting process, a coating and developing system including the adhesion promoting device, and a storage medium storing a program specifying a set of instructions for carrying out the adhesion promoting process. The adhesion promoting process includes the steps of: placing a workpiece on a support table disposed in a processing space defined by a processing vessel; adjusting the temperature of the workpiece placed on the support table to a first temperature at which an adhesion promoting gas does not condense on the workpiece in dew drops; supplying the adhesion promoting gas to the temperature-controlled workpiece to make a surface of the workpiece hydrophobic through the interaction of molecules contained in the adhesion promoting gas and the surface of the workpiece; and adjusting the temperature of the workpiece to a second temperature higher than the first temperature to supply thermal energy to excessive molecules remaining on the surface of the workpiece and evacuating the processing space to remove the excessive molecules from the surface of the workpiece.
机译:本发明提供一种使用较少量的用于加工工件的粘合促进气体的粘合促进过程,用于进行粘合促进过程的粘合促进装置,包括该粘合促进装置的涂布显影系统以及存储介质的存储装置。一个程序,该程序指定用于执行增粘过程的一组指令。促进粘附的过程包括以下步骤:将工件放置在设置在由处理容器限定的处理空间中的支撑台上;将放置在支撑台上的工件的温度调节至第一温度,在该第一温度下,附着力促进气体不会在露滴中凝结在工件上;通过增粘气体中所含的分子与工件表面的相互作用,将增粘气体供应至温度受控的工件,以使工件表面疏水。将工件的温度调节到高于第一温度的第二温度,以向剩余在工件表面上的过量分子提供热能,并抽空处理空间以从工件表面上去除过量的分子。

著录项

  • 公开/公告号JP5303954B2

    专利类型

  • 公开/公告日2013-10-02

    原文格式PDF

  • 申请/专利权人 東京エレクトロン株式会社;

    申请/专利号JP20080035098

  • 发明设计人 北野 高広;福岡 哲夫;

    申请日2008-02-15

  • 分类号H01L21/027;B05C9/10;B05B15/00;B05D3/04;

  • 国家 JP

  • 入库时间 2022-08-21 16:56:18

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