DICING OPERATION DEVICE AND SEMICONDUCTOR DEVICE COMPONENT CONSTITUTING METHOD, AND METHOD FOR RECOGNIZING LEVEL DIFFERENCE FORMED WITH OBJECT OF DICING PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide: a dicing operation device that suppresses a defect occurrence rate in an LSI mounting step and enhances processing precision in manufacture; a semiconductor device component constituting method; and a method for recognizing a level difference formed with an object of dicing processing.;SOLUTION: The dicing operation device, which includes a dicing blade 11 and a dicing stage unit 12 and performs dicing operation when dividing a semiconductor chip 22, has: a dicing blade height detection unit 13; and a dicing stage height detection unit 14. The dicing operation device further includes sensors 13 and 14 which detect each of a dicing plate unit distance length 31, a dicing stage unit distance length 32, and a semiconductor pattern unit distance length 33. The method of constituting components of the semiconductor device by performing the dicing operation when dividing the semiconductor chip 22 includes: measuring the dicing plate unit distance length 31; measuring the dicing stage unit distance length 32; and measuring the semiconductor pattern unit distance length 33.;COPYRIGHT: (C)2009,JPO&INPIT