METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, CAPABLE OF DICING A SUBSTRATE BY FORMING A CUT PART AND A DICING LINE ON THE REAR OF THE SUBSTRATE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve the efficiency of a die separation provides by performing a dicing process by forming a dicing line on the rear of a semiconductor substrate.;CONSTITUTION: A substrate with the front side with a circuit pattern and the rear side is prepared(S110). A photographing unit reads the information of the circuit pattern formed on the front side by transmitting the substrate on the rear(S130). A cut part is formed on the rear of the substrate(S140). A dicing line is formed by grinding the rear with a part of the cut part(S150). An expansion tape is attached to the rear of the substrate on which a dicing line is formed(S160). A plurality of chips are formed by expanding the expansion tape and separating the substrate along the dicing line(S170).;COPYRIGHT KIPO 2010