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SURFACE-MOUNTING ELECTRONIC COMPONENT AND SURFACE-MOUNTING ELECTRONIC COMPONENT ARRAY

机译:表面安装电子组件和表面安装电子组件阵列

摘要

PPROBLEM TO BE SOLVED: To provide a surface-mounting electronic component and a surface-mounting electronic component array for preventing an element body from being cracked easily by relaxing stress to the element body. PSOLUTION: A surface-mounting capacitor 1 comprises a dielectric element body 10 and an external electrode 16A. The dielectric element body 10 has a main surface 10a and sides 10c-10f. The external electrode 16A comprises a fired electrode layers 18A, a resin electrode layer, and a first plated layer and a second plated layer. The fired electrode layer 18A is formed on a main surface 10a of the dielectric element body 10 so that the fired electrode layer 18A is not on edge sections E1-E4 and is of a circular shape when viewed from the side of the main surface 10a. PCOPYRIGHT: (C)2009,JPO&INPIT
机译:

要解决的问题:提供一种表面安装电子部件和表面安装电子部件阵列,以防止元件体因应力松弛而容易破裂。

解决方案:表面安装电容器1包括介电元件主体10和外部电极16A。介电元件主体10具有主表面10a和侧面10c-10f。外部电极16A包括烧成的电极层18A,树脂电极层,第一镀层和第二镀层。烧成电极层18A形成在介电元件主体10的主表面10a上,使得烧成电极层18A不在边缘部分E1-E4上,并且从主表面10a的侧面观察时呈圆形。

版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP2009218354A

    专利类型

  • 公开/公告日2009-09-24

    原文格式PDF

  • 申请/专利权人 TDK CORP;

    申请/专利号JP20080059707

  • 发明设计人 KOMATSU TAKASHI;YOSHII AKITOSHI;

    申请日2008-03-10

  • 分类号H01G4/252;H01G4/38;

  • 国家 JP

  • 入库时间 2022-08-21 19:44:38

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