HIGH-DENSITY ELECTRODE SOCKET, AND MOUNTING METHOD AND POSITION ADJUSTMENT UNIT OF ELECTRONIC COMPONENT PACKAGE USING HIGH-DENSITY ELECTRODE SOCKET

摘要

PROBLEM TO BE SOLVED: To enable to secure electrical contact state of an electrode of an electronic component package and a needle-like contact of a high-density electrode socket even in the case position slippage arises to the electrode of the electronic component package.;SOLUTION: The inner shape of an insertion recess 13 of an LGA socket 1 is formed rather larger so that the mounting position of an LGA 102 may be adjusted along the row direction of the needle-like contact 2 of the LGA socket 1, and the mounting position of the LGA 102 is adjusted by package position adjusting screws 7, 8, 9, 10 installed penetrating the wall faces 3, 4, 5, 6 of the insertion recess 13.;COPYRIGHT: (C)2009,JPO&INPIT