APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE, CAPABLE OF PASSING A PLURALITY OF BALL TYPE TERMINALS BY PUNCHING A NUMBER OF PENETRATION HOLES AT A POSITION CORRESPONDING TO AN ELECTRODE TERMINAL OF A SOCKET UNIT IN A CONTACT GUIDE

摘要

PURPOSE: An apparatus for testing a semiconductor package is provided to improve test accuracy by making a ball type terminal contact an accurate position by guiding the ball type terminal to an electrode terminal.;CONSTITUTION: A test apparatus includes a substrate (10), a socket unit (12), a pickup unit (14) and a contact guide (16). The substrate arranges at least more than one contact terminal. The socket unit is arranged on the upper part of the substrate, and arranges a top electrode terminal and a bottom electrode terminal at a position corresponding to the ball type terminal of a semiconductor package (P) on an upper plane and a lower plane respectively. The pickup unit is arranged on the upper part of the socket unit, and the semiconductor package is inserted and fixed in the pickup unit. The contact guide is fixed to the lower part of the pickup unit, and inserts a plurality of ball type terminals by forming a number of penetration holes. The contact guide is guided to the contact position of the electrode terminal of the socket unit, and prevents electric shock which is able to occur among a number of ball type terminals.;COPYRIGHT KIPO 2013