SURFACE WORKING METHOD FOR DISCHARGE PLASMA PROCESSING APPARATUS, APPLICATION ELECTRODE, AND DISCHARGE PLASMA PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a surface working method of a discharge plasma processing apparatus, an application electrode and a discharge plasma processing apparatus for achieving highly precise flattening by a one-time operation process, thereby improving the efficiency of working.;SOLUTION: Discharge plasma P forms hollow discharge plasma Ph and grow discharge plasma Pg. A processing face 14a of the substrate 14 is deeply dug by the hollow discharge plasma Ph formed at the central part of the discharge plasma P. In this case, the protrusion of the irregularities formed on a processing face 14a of the substrate 14 by digging by the hollow discharge plasma Ph is etched by glow discharge plasma Pg formed in the outer periphery of the hollow discharge plasma Ph so that the highly precise substrate is flattened. Also, the discharge plasma P simultaneously forms the hollow discharge plasma Ph and the glow discharge Pg, and the substrate 14 is synchronously etched.;COPYRIGHT: (C)2010,JPO&INPIT