首页> 外国专利> METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT

METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT

机译:粘合剂输送夹具的金属膜处理及基材的固溶印刷法。

摘要

PROBLEM TO BE SOLVED: To provide a metal mask dealing with an adhesive conveying jig, in which the adhesion of a portion bulged out of the substrate contact face side external shape of a substrate in the metal mask to the adhesive part of the adhesive conveying jig is reduced at the creamy solder printing of the substrate, a plate separation is performed smoothly and the reduction of a cycle time can be contrived.;SOLUTION: This metal mask 3 dealing with the adhesive conveying jig 8 is employed by fixing the substrate by making the substrate 7 adhesive with an electronic circuit formed thereon to the adhesive part of the adhesive conveying jig and by performing the creamy solder printing of the substrate by bringing the substrate contact face side of the metal mask into contact onto the substrate, by alternately providing a large number of recessed groove parts 31 extending diagonally parallel and a large number of projected stripe parts 32 extending diagonally parallel in a region nearly equal to the adhesive part contacting region of the adhesive conveying jig at the substrate contacting face side of the metal mask dealing with the adhesive conveying jig, the contacting area of the metal mask with the adhesive part during squeegeeing becomes smaller owing to the existence of the recessed groove parts 31.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种用于处理粘合剂输送夹具的金属掩模,其中,从金属掩模中的衬底的基板接触面侧的外部凸出的部分的粘附力粘附至粘合剂输送夹具的粘合剂部分。通过在基板上进行乳脂状的焊料印刷来减少印版,可以顺利地进行板分离,并且可以缩短循环时间。解决方案:该用于处理粘合剂输送夹具8的金属掩膜3通过固定基板来使用通过将金属掩模的基板接触面侧接触到基板上,交替地设置一个或多个基板,在其上形成有电子电路的基板7粘合剂形成在粘合剂输送夹具的粘合剂部分上,并且通过将金属掩模的基板接触面侧接触到基板上而进行乳状焊料印刷在区域nea中,大量对角平行延伸的凹槽部分31和大量对角平行延伸的突出的条纹部分32由于在与胶粘剂输送夹具相对的金属掩模的基板接触面侧的面积等于胶粘剂输送夹具的粘合剂部分接触区域,所以在刮涂期间金属掩模与胶粘剂部分的接触面积变小。凹槽部分31 .;版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP2009012230A

    专利类型

  • 公开/公告日2009-01-22

    原文格式PDF

  • 申请/专利权人 BONMAAKU:KK;

    申请/专利号JP20070174524

  • 发明设计人 KATSUYAMA EIICHI;

    申请日2007-07-02

  • 分类号B41N1/24;H05K3/34;B41M1/12;B41F15/08;B41F15/36;

  • 国家 JP

  • 入库时间 2022-08-21 19:42:57

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号