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METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT
METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT
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机译:粘合剂输送夹具的金属膜处理及基材的固溶印刷法。
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摘要
PROBLEM TO BE SOLVED: To provide a metal mask dealing with an adhesive conveying jig, in which the adhesion of a portion bulged out of the substrate contact face side external shape of a substrate in the metal mask to the adhesive part of the adhesive conveying jig is reduced at the creamy solder printing of the substrate, a plate separation is performed smoothly and the reduction of a cycle time can be contrived.;SOLUTION: This metal mask 3 dealing with the adhesive conveying jig 8 is employed by fixing the substrate by making the substrate 7 adhesive with an electronic circuit formed thereon to the adhesive part of the adhesive conveying jig and by performing the creamy solder printing of the substrate by bringing the substrate contact face side of the metal mask into contact onto the substrate. Frame-like recessed parts 31 for avoiding the contact with the adhesive pat of the adhesive conveying jig during squeegeeing are formed in a portion, which lies within the adhesive part contacting region of the adhesive conveying jig at the substrate contacting face side of the metal mask dealing with the adhesive conveying jig.;COPYRIGHT: (C)2009,JPO&INPIT
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