首页> 外国专利> METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT

METAL MASK DEALING WITH ADHESIVE CONVEYING JIG AND SOLDER PRINTING METHOD OF SUBSTRATE BY EMPLOYING IT

机译:粘合剂输送夹具的金属膜处理及基材的固溶印刷法。

摘要

PROBLEM TO BE SOLVED: To provide a metal mask dealing with an adhesive conveying jig, in which the adhesion of a portion bulged out of the substrate contact face side external shape of a substrate in the metal mask to the adhesive part of the adhesive conveying jig is reduced at the creamy solder printing of the substrate, a plate separation is performed smoothly and the reduction of a cycle time can be contrived.;SOLUTION: This metal mask 3 dealing with the adhesive conveying jig 8 is employed by fixing the substrate by making the substrate 7 adhesive with an electronic circuit formed thereon to the adhesive part of the adhesive conveying jig and by performing the creamy solder printing of the substrate by bringing the substrate contact face side of the metal mask into contact onto the substrate. Frame-like recessed parts 31 for avoiding the contact with the adhesive pat of the adhesive conveying jig during squeegeeing are formed in a portion, which lies within the adhesive part contacting region of the adhesive conveying jig at the substrate contacting face side of the metal mask dealing with the adhesive conveying jig.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种用于处理粘合剂输送夹具的金属掩模,其中,从金属掩模中的衬底的基板接触面侧的外部凸出的部分的粘附力粘附至粘合剂输送夹具的粘合剂部分。通过在基板上进行乳脂状的焊料印刷来减少印版,可以顺利地进行板分离,并且可以缩短循环时间。解决方案:该用于处理粘合剂输送夹具8的金属掩膜3通过固定基板来使用基板7在其上形成有电子电路的粘合剂粘附至粘合剂输送夹具的粘合剂部分,并且通过使金属掩模的基板接触面侧与基板接触来进行基板的膏状焊料印刷。在金属掩模的基板接触面侧的,位于粘接剂输送夹具的粘接剂接触区域内的部分中,形成有用于避免刮擦时与粘接剂输送夹具的粘接剂接触的框状的凹部31。胶粘剂输送夹具的加工; COPYRIGHT:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2009012231A

    专利类型

  • 公开/公告日2009-01-22

    原文格式PDF

  • 申请/专利权人 BONMAAKU:KK;

    申请/专利号JP20070174525

  • 发明设计人 KATSUYAMA EIICHI;

    申请日2007-07-02

  • 分类号B41N1/24;H05K3/34;B41M1/12;B41F15/08;B41F15/36;

  • 国家 JP

  • 入库时间 2022-08-21 19:42:57

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