CUTTING METHOD OF MULTILAYER SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, LIGHT-EMITTING DEVICE, AND BACKLIGHT DEVICE

摘要

PROBLEM TO BE SOLVED: To cut, without generating burrs, a multilayer substrate wherein a first metal layer is formed on the front surface and a second metal layer is formed on the rear surface.;SOLUTION: The cutting method of multilayer substrate 2 with a metal layer 3 formed on the front surface and a rear surface electrode 4 formed on the rear surface includes a step of cutting the multilayer substrate 2 up to the intermediate part of thickness from the side of the metal layer 3 and the side of the rear surface electrode 4. A cut margin width in the side of the metal layer 3 is different from that in the side of the rear surface electrode 4.;COPYRIGHT: (C)2009,JPO&INPIT