HEAT CONDUCTIVE PRINTED WIRING BOARD, HEAT CONDUCTIVE PREPREG USED THEREFOR AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING THE HEAT CONDUCTIVE PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board which hardly cracks even when its heat conductivity is increased.;SOLUTION: At a center part of a heat conductive printed wiring board 10, a core layer 18 is formed by laminating one or more internal composite layers 12 including glass fiber 17 and one or more internal electrodes 14 respectively, and further an external layer composite layer 11 including no glass fiber 17 is formed on one or more surfaces of the core layer 18, thereby obtaining the heat conductive printed wiring board 10 which has high heat conductivity and hardly cracks.;COPYRIGHT: (C)2009,JPO&INPIT