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Acquiring the information of all layers from thermal design simulation support manner of the multilayer printed circuit substrate, and the graph data
Acquiring the information of all layers from thermal design simulation support manner of the multilayer printed circuit substrate, and the graph data
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机译:从多层印刷电路板的热设计仿真支持方式获取所有层的信息以及图形数据
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摘要
PROBLEM TO BE SOLVED: To provide a thermal design simulation support method and a thermal design simulation support program for a multilayered printed circuit board, which are capable of generating a simulation model allowing a thermal influence to be accurately predicted.;SOLUTION: The program takes out information of wiring patterns 11a to 11h, through holes 12a to 12l, heat generation sources 13a and 13b, resin 14a to 14d, etc. included in first to fourth layers 10a to 10d of the multilayered printed circuit board, from a data file being in a two-dimensional CAD format and adds information required for thermal design simulation, such as materials and dimensions to the taken-out information to generate a simulation model. This program is utilized to perform a model generating work.;COPYRIGHT: (C)2005,JPO&NCIPI
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