The negative die resist constituent and pattern formation manner null consists of with the based polymer and the silicon content building a bridge medicine which include the epoxy ring of the semiconductor device which utilizes this

摘要

A negative resist composition and a patterning method for semiconductor devices using the composition are provided. In one aspect, a negative resist composition comprises an alkali-soluble base polymer having an epoxy ring substituent, a silicon-containing crosslinker having multiple hydroxy groups, and a photoacid generator. In another aspect, a patterning method includes using the negative resist composition in a bi-layer resist process to form fine patterns.