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Printed circuit board and printed circuit board design method, IC package connection terminal design method, and IC package connection method
Printed circuit board and printed circuit board design method, IC package connection terminal design method, and IC package connection method
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机译:印刷电路板及印刷电路板的设计方法,ic封装连接端子的设计方法以及ic封装连接的方法
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摘要
The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board (1), soldering lands (2a), (2b), (2c), and (2d) for connecting solder balls are disposed in lattice. Central point (B) of through-hole (3) is set eccentric to the side of soldering land (2a) at the same potential as through-hole (3), remote from intersection (A) formed by diagonal line (200ab) linking soldering lands (2a) and (2b) and diagonal line (200cd) linking soldering lands (2c) and (2d).
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