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PRINTED CIRCUIT BOARD, DESIGNING METHOD OF PRINTED CIRCUIT BOARD, CONNECTION TERMINAL DESIGNING METHOD OF IC PACKAGE, AND CONNECTING METHOD OF IC PACKAGE
PRINTED CIRCUIT BOARD, DESIGNING METHOD OF PRINTED CIRCUIT BOARD, CONNECTION TERMINAL DESIGNING METHOD OF IC PACKAGE, AND CONNECTING METHOD OF IC PACKAGE
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机译:印刷电路板,印刷电路板的设计方法,IC封装的连接端子设计方法以及IC封装的连接方法
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摘要
THE INVENTION PROVIDES A PRINTED CIRCUIT BOARD CAPABLE OF MOUNTING BGA OR OTHER IC PACKAGE OF NARROW TERMINAL INTERVAL BY USING THROUGH-HOLES OF CONVENTIONAL SIZE. ON ONE PRINCIPAL SURFACE OF PRINTED CIRCUIT BOARD (1), SOLDERING LANDS (2A), (2B), (2C), AND (2D) FOR CONNECTING SOLDER BALLS ARE DISPOSED IN LATTICE. CENTRAL POINT (B) OF THROUGH-HOLE (3) IS SET ECCENTRIC TO THE SIDE OF SOLDERING LAND (2A) AT THE SAME POTENTIAL AS THROUGH-HOLE (3), REMOTE FROM INTERSECTION (A) FORMED BY DIAGONAL LINE (200AB) LINKING SOLDERING LANDS (2A) AND (2B) AND DIAGONAL LINE (200CD) LINKING SOLDERING LANDS (2C) AND (2D). FIG. 1
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