The solder alloy, the solder ball and the oolder joint section which uses that

摘要

This invention with mass%, as Ni and the remainder which satisfy the relationship of 0.1 - 1.5% Ag and 0.5 - 0.75% Cu between 12.5Cu/Ni100 is something regarding the Pb free solder alloy which consists of Sn and the inevitable impurity. The solder alloy, includes 0.3 - 1.2% Ag to ideal, with mass%. In addition, the solder alloy, includes 0.01 - 0.04% Ni to ideal, with mass%. In addition as for this invention, being spheroidized, it is something regarding the solder ball which becomes. In addition, the solder alloy of this invention, being connected by the Ni electrode, is ideal as the oolder joint section which becomes. This invention solder alloy is superior in resistance falling shocking characteristic, can control the decrease of the connecting strength under hot environment of long haul.