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The photosensitive resin composition, and the photosensitive element which uses this, formation method of resist pattern, production method of the printed circuit board and production method of the partition for the plasma display panel.

机译:感光性树脂组合物和使用该感光性树脂组合物的感光性元件,抗蚀剂图案的形成方法,印刷电路板的制造方法以及等离子显示面板用隔板的制造方法。

摘要

(A) the binder polymer and, (B) the optical radical polymerization initiator which includes Mitusige affinity chemical compound and the (C)2,4,5- thoria reel imidazole dimer or that derivative which possess polymerization possible ethylene characteristic unsaturated bond and, (D) the below-mentioned general formula the chemical compound which is shown with (1) and, the photosensitive resin composition which is contained. Conversion 1 Formula (1) in, R1 and R2 carbon count displays alkyl group 1 - 20 etc in the respective independence, R3, R4, R5, R6, R7, R8, R9 and R10 shows the hydrogen atom and the like in the respective independence.
机译:(A)粘合剂聚合物,以及(B)包含Mitusige亲和性化合物和(C)2,4,5- thoria reel咪唑二聚体或具有可能的乙烯特性不饱和键的衍生物的光自由基聚合引发剂,和(D)下述通式(1)所示的化合物及其所含的感光性树脂组合物。<转化1>式(1)中,R 1 及R 2 碳数分别显示烷基1-20等,R 3 ,R 4 ,R 5 ,R 6 ,R 7 ,R 8 ,R 9 和R 10

著录项

  • 公开/公告号JPWO2007004619A1

    专利类型

  • 公开/公告日2009-01-29

    原文格式PDF

  • 申请/专利权人 日立化成工業株式会社;

    申请/专利号JP20070524058

  • 发明设计人 宮坂 昌宏;熊木 尚;

    申请日2006-07-03

  • 分类号G03F7/031;G03F7/004;H01J9/02;H01J11/02;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:01

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