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SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANICAL PERFORMANCE
SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANICAL PERFORMANCE
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机译:焊接缓冲器互连,可提高机械性能和热机械性能
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摘要
An apparatus and method for a semiconductor package including a bump on input-output (IO) structure are disclosed involving a device pad, an under bump metal pad (UBM), a polymer, and a passivation layer. The shortest distance from the center of the device pad to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.5:1 to 0.95:1. Also, the shortest distance from the center of the polymer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.85:1. Additionally, the shortest distance from the center of the passivation layer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.80:1.
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