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Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate

机译：在柔性PET基板上改善MWCNT / IN-BI复合焊料的电气和热机械性能

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Sang Hoon Kim; Min-soo Park; Joon-Phil Choi; Clodualdo Aranas;
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年度 2017
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1. 温度对基于MWCNTs/PDMS复合材料的柔性应变传感器的影响 [J] . 郭登机, 潘旭东, 何虎中南大学学报（英文版） . 2020,第011期
2. Thermo-mechanical evolution of ternary Bi-Sn-In solder micropowders and nanoparticles reflowed on a flexible PET substrate [J] . Kim Sang Hoon, Yang Dong-Yeol, Kim Yong-Jin, Applied Surface Science . 2017,第Sepa1期

机译：三元Bi-Sn-In焊料微粉和纳米颗粒在柔性PET基板上回流的热机械演化
3. Microstructural transformation and thermo-mechanical improvement of quinary Bi-Sn-In-Ga-Zn solder bumps on a flexible PET substrate [J] . Kim Sanghoon, Nam Younggyun, Lee Haengna, Materials Science and Engineering . 2017,第octa期

机译：柔性PET衬底上的Bi-Sn-In-Ga-Zn五元Bi-Sn-In-Ga-Zn焊料凸点的微结构转变和热机械改进
4. Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes [J] . Liu (Dr) Yang, Fu Haifeng, Sun Fenglian, Journal of Materials Processing Technology . 2016,第Null期

机译：回流后Sn58Bi复合焊膏的组织和力学性能
5. Joint properties of micro Sn-58Bi solder bumps on flexible substrate [C] . 14th International Conference on Electronic Materials and Packaging . 2012

机译：柔性基板上的微型Sn-58Bi焊料凸点的结合特性
6. Liquid-Phase Diffusion Bonding and the Development of a Cu-Ni/Sn Composite Solder Paste for High Temperature Lead-Free Electrical Connections [D] . Choquette, Stephanie Michele. 2018

机译：液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
7. Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate [O] . Sang Hoon Kim, Min-soo Park, Joon-Phil Choi, -1

机译：改进了在柔性PET基板上回流的MWCNT / In-Sn-Bi复合焊料的电和热机械性能
8. A strategy for achieving low percolation and high electrical conductivity in melt-blended polycarbonate (PC)/multiwall carbon nanotube (MWCNT) nanocomposites: Electrical and thermo-mechanical properties [O] . B. B. Khatua, S. Maiti, N. K. Shrivastava, 2013

机译：在熔融共混聚碳酸酯（pC）/多壁碳纳米管（mWCNT）纳米复合材料中实现低渗透和高导电性的策略：电气和热机械性能

Improved electrical and thermo-mechanical properties of a MWCNT/In–Sn–Bi composite solder reflowing on a flexible PET substrate

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