Exposure method and exposure apparatus, stage unit, and device manufacturing method having two substrate stages with one stage temporarily positioned below the other stage

摘要

By an exposure method including a process where in parallel with an exposure operation performed on a wafer on one of the wafer stages, the other wafer stage is temporarily positioned under the one wafer stage in order to interchange both wafer stages, a part of the interchange operation (exchange operation) of both stages according to a procedure of temporarily positioning the other wafer stage under the one wafer stage can be performed in parallel with the exposure operation of the wafer on the one wafer stage. Accordingly, the interchange can be performed in a shorter period of time than when the interchange operation begins from the point where the exposure operation of the wafer on the one wafer stage has been completed.