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Multiprocessor system using stacked processor modules and board to board connectors

机译:使用堆叠式处理器模块和板对板连接器的多处理器系统

摘要

A multiprocessor system is provided, comprising a baseboard, for arranging peripheral equipments; and a plurality of processor modules, each equipped with a processor and a board-to-board connector; wherein the plurality of processor modules are stacked up, with board-to-board connectors being electrically connected between the processor modules and between the processor modules and the baseboard; the processors communicate with the peripheral equipments in accordance with a specific bus specification; and the operations of the plurality of processor modules are coordinated by routes provided between the processor modules and between the processor modules and the baseboard.
机译:提供了一种多处理器系统,包括基板,用于布置外围设备。多个处理器模块,每个处理器模块配备有处理器和板对板连接器。其中多个处理器模块堆叠在一起,板对板连接器电连接在处理器模块之间以及处理器模块和基板之间;处理器按照特定的总线规范与外围设备通信;多个处理器模块的操作通过设置在处理器模块之间以及处理器模块和基板之间的路由来协调。

著录项

  • 公开/公告号US7606959B2

    专利类型

  • 公开/公告日2009-10-20

    原文格式PDF

  • 申请/专利权人 LI YAO;WEI CHEN;

    申请/专利号US20060606307

  • 发明设计人 LI YAO;WEI CHEN;

    申请日2006-11-27

  • 分类号G06F13/00;

  • 国家 US

  • 入库时间 2022-08-21 19:31:59

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