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Method of fabricating complementary metal-oxide-semiconductor transistor and metal-oxide-semiconductor transistor

机译:互补金属氧化物半导体晶体管的制造方法及金属氧化物半导体晶体管

摘要

A method of fabricating a metal-oxide-semiconductor transistor is provided. A first gate structure and a second gate structure are formed on a substrate. The first gate structure has a dimension greater than the second gate structure. Then, first lightly doped drain regions are formed in the substrate on two sides of the first gate structure. A lightly doped drain annealing process is performed. Next, second lightly doped drain regions are formed in the substrate on two sides of the second gate structure. First spacers are formed on the sidewalls of the first gate structure and second spacers are formed on the sidewalls of the second gate structure at the same time. Afterwards, first source/drain regions are formed in the substrate on two sides of the first spacers and second source/drain regions are formed in the substrate on two sides of the second spacers. A source/drain annealing process is performed.
机译:提供了一种制造金属氧化物半导体晶体管的方法。在基板上形成第一栅极结构和第二栅极结构。第一栅极结构的尺寸大于第二栅极结构的尺寸。然后,在第一栅极结构的两侧上的衬底中形成第一轻掺杂漏极区。进行轻掺杂的漏极退火工艺。接下来,在第二栅极结构的两侧上的衬底中形成第二轻掺杂漏极区。第一间隔物形成在第一栅极结构的侧壁上,并且第二间隔物同时形成在第二栅极结构的侧壁上。之后,在第一隔离物的两侧的衬底中形成第一源/漏区,并且在第二隔离物的两侧的衬底中形成第二源/漏区。执行源极/漏极退火工艺。

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