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Solid state power amplifier with multi-planar MMIC modules
Solid state power amplifier with multi-planar MMIC modules
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机译:具有多平面MMIC模块的固态功率放大器
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摘要
A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. An MMIC power amplifier module may include a backing, a board, at least one MMIC, and/or a cover. A method for dissipating heat within an SSPA may include receiving an RF signal, splitting the RF signal, amplifying multiple RF signals, combining the multiple RF signals, generating heat, and/or dissipating heat.
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