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Process for making stacks of islands made of one semiconducting material encapsulated in another semiconducting material

机译:制造由一种封装在另一种半导体材料中的半导体材料制成的岛堆的方法

摘要

The invention relates to the production of a stacked structure of planes of islands of a first semiconducting material encapsulated in a second semiconducting material on a substrate, comprising alternate deposition of planes of islands of a first semiconducting material and encapsulation layers of a second semiconducting material, the planes of islands of the first semiconducting material being made at an optimum growth temperature and at an optimum precursor gas partial pressure to result in a stacked structure for which the optical properties enable production of optoelectronic components to optically interconnect integrated circuits. The stacked structure is made on a plane of islands of a third semiconducting material called the sacrificial plane encapsulated in a fourth semiconducting material, the islands of the sacrificial plane being made under growth conditions that can result in high densities of small islands, in other words at a temperature below the optimum growth temperature and/or at a precursor gas partial pressure greater than the optimum partial pressure.
机译:本发明涉及封装在衬底上的第二半导体材料中的第一半导体材料的岛平面的堆叠结构的制造,该结构包括交替沉积第一半导体材料的岛平面和第二半导体材料的封装层,在最佳生长温度和最佳前驱体气体分压下制造第一半导体材料的岛平面,以形成堆叠结构,该堆叠结构的光学特性使得能够制造光电组件以光学互连集成电路。堆叠结构是在被封装在第四半导体材料中的第三半导体材料的岛平面(称为牺牲面)上制成的,牺牲面的岛是在生长条件下制成的,换言之,可能导致小岛的高密度,换句话说,在低于最佳生长温度的温度下和/或在大于最佳分压的前体气体分压下进行。

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