首页> 外国专利> Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

机译:用于安装ic芯片的基板,用于主板的基板,用于光通信的装置,用于安装ic芯片的基板的制造方法以及用于主板的基板的制造方法

摘要

The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, in which a conductor circuit and an insulating layer are laminated in alternate fashion and in repetition on both faces of a substrate and an optical element is mounted on the substrate. Herein, the substrate for mounting an IC chip includes an optical signal passing region, and a microlens arranged on an end portion of the optical signal passing region on the opposite side from the optical element.
机译:本发明的目的在于提供一种用于安装IC芯片的基板,在其上形成光信号通过区域,并且该基板可以抑制光信号中的传输损耗并且可以更加可靠地更可靠地传输光信号。根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板,其中导体电路和绝缘层以交替的方式并且在基板的两个面上重复地层叠并且安装了光学元件。在基材上。在此,用于安装IC芯片的基板包括光信号通过区域和微透镜,该微透镜布置在光信号通过区域中与光学元件相反的一侧的端部上。

著录项

  • 公开/公告号US7526152B2

    专利类型

  • 公开/公告日2009-04-28

    原文格式PDF

  • 申请/专利权人 MOTOO ASAI;HIROAKI KODAMA;

    申请/专利号US20070964761

  • 发明设计人 MOTOO ASAI;HIROAKI KODAMA;

    申请日2007-12-27

  • 分类号G02B6/14;

  • 国家 US

  • 入库时间 2022-08-21 19:29:27

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