A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED SURFACES OF MATERIALS AND AN AQUEOUS POLISHING AGENT TO BE USED IN THE SAID PROCESS

摘要

Process for the polishing of patterned and unstructured surfaces of materials, wherein an aqueous polishing agent is used, which aqueous polishing agent comprises (A) at least one bi- or multifunctional compound (a1 ) capable of forming out of its aqueous solution and/or dispersion a passivating film on top of a surface of a metal M or of an alloy of the metal M, the said metal M having a standard reduction potential E0 -0.1 V for the half-reaction M - Mn+ + n e-, wherein n = integer of from 1 to 4 and e- = electron; and, at the same time, (a2) capable of forming chelate complexes with the said metal M and/or its ions in aqueous solution and/or dispersion; and (B) at least one oxidizing agent; and an aqueous polishing agent, containing (A) at least one bi- or multifunctional compound (a1 ) capable of forming out of its aqueous solution and/or dispersion a passivating film on top of a surface of a metal M or of an alloy of the metal M, the said metal M having a standard reduction potential E0 -0.1 V for the half-reaction M - Mn+ + n e-, wherein n = integer of from 1 to 4 and e- = electron; and, at the same time, (a2) capable of forming chelate complexes with the said metal M and/or its ions in aqueous solution and/or dispersion; (B) at least one oxidizing agent; and (C) at least one solid, finely divided abrasive.