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AN AQUEOUS POLISHING AGENT COMPRISING SOLID POLYMER PARTICLES AND TWO COMPLEXING AGENTS AND ITS USE IN A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES
AN AQUEOUS POLISHING AGENT COMPRISING SOLID POLYMER PARTICLES AND TWO COMPLEXING AGENTS AND ITS USE IN A PROCESS FOR POLISHING PATTERNED AND UNSTRUCTURED METAL SURFACES
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机译:包含固体聚合物颗粒和两种络合剂的水性抛光剂及其在抛光图案化和非结构化金属表面的过程中的用途
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摘要
An aqueous CMP agent, comprising (A) solid polymer particles interacting and forming strong complexes with the metal of the surfaces to be polished; (B) a dissolved organic non-polymeric compound interacting and forming strong, water-soluble complexes with the metal and causing an increase of the material removal rate MRR and the static etch rate SER with increasing concentration of the compound (B); and (C) a dissolved organic non-polymeric compound interacting and forming slightly soluble or insoluble complexes with the metal, which complexes are capable of being adsorbed by the metal surfaces, and causing a lower increase of the MRR than the compound (B) and a lower increase of the SER than the compound (B) or no increase of the SER with increasing concentration of the compound (C); a CMP process comprising selecting the components (A) to (C) and the use of the CMP agent and process for polishing wafers with ICs.
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