SEMICONDUCTOR FAILURE ANALYZER, SEMICONDUCTOR FAILURE ANALYSIS METHOD AND SEMICONDUCTOR FAILURE ANALYSIS PROGRAM

摘要

A failure analyzer (10) is provided with an inspection information acquiring section (11) for acquiring a failure monitor image (P2) of a semiconductor device; a layout information acquiring section (12) for acquiring layout information; and a failure analysis section (13) which performs failure analysis. The failure analysis section (13) refers to the failure monitor image, and sets an analysis region in accordance with reaction information obtained from the failure monitor image. Then, the failure analysis section extracts, as a failure candidate wiring, a wiring passing through the analysis region from among a plurality of wirings included in the layout of the semiconductor device, refers to each distance between the candidate wiring and other wiring of the plurality of wirings, and acquires proximity wring information for the candidate wiring. Thus, the semiconductor failure analyzer which can surely and efficiently analyze failures of the semiconductor device by using the failure monitor image, an analysis method and an analysis program are provided.