首页> 外国专利> METHOD TO FABRICATE FULLY SILICIDED N-POLYSILICON AND P-POLYSILICON IN A CMOS PROCESS FLOW

METHOD TO FABRICATE FULLY SILICIDED N-POLYSILICON AND P-POLYSILICON IN A CMOS PROCESS FLOW

机译:在CMOS工艺流程中制备完全硅化的N型多晶硅和P型多晶硅的方法

摘要

An improved method of forming a fully suicided (FUSI) gate in both NMOS and PMOS transistors of the same MOS device is disclosed. In one example, the method comprises forming a first suicide in at least a top portion of a gate electrode of the PMOS devices and not over the NMOS devices. The method further comprises concurrently forming a second silucide in at least a top portion of a gate electrode of both the NMOS and PMOS devices, and forming a FUSI gate suicide of the gate electrodes. In one embodiment, the thickness of the second suicide is greater than the first suicide by an amount which compensates for a difference in the rates of suicide formation between the NMOS and PMOS devices.
机译:公开了在同一MOS器件的NMOS和PMOS晶体管两者中形成全硅化(FUSI)栅极的改进方法。在一个示例中,该方法包括在PMOS器件的栅电极的至少顶部中并且不在NMOS器件之上形成第一硅化物。该方法还包括同时在NMOS和PMOS器件的栅电极的至少顶部中形成第二硅化物,以及形成栅电极的FUSI栅硅化物。在一个实施例中,第二硅化物的厚度大于第一硅化物的厚度,该量补偿了NMOS和PMOS器件之间的硅化物形成速率的差异。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号